HUINS MFP-VU19P-PCIe Virtex UltraScale+ VU19P FPGA prototyping board front view
HUINS MFP-VU19P-PCIe FPGA board interface overview
HUINS MFP-VU19P-PCIe FPGA board bracket and QSFP perspective view
HUINS MFP-VU19P-PCIe FPGA board power input perspective view
HUINS MFP-VU19P-PCIe FPGA prototyping board rear view
HUINS MFP-VU19P-PCIe FPGA board outline and dimensions
  • Load image into Gallery viewer, HUINS MFP-VU19P-PCIe Virtex UltraScale+ VU19P FPGA prototyping board front view
  • Load image into Gallery viewer, HUINS MFP-VU19P-PCIe FPGA board interface overview
  • Load image into Gallery viewer, HUINS MFP-VU19P-PCIe FPGA board bracket and QSFP perspective view
  • Load image into Gallery viewer, HUINS MFP-VU19P-PCIe FPGA board power input perspective view
  • Load image into Gallery viewer, HUINS MFP-VU19P-PCIe FPGA prototyping board rear view
  • Load image into Gallery viewer, HUINS MFP-VU19P-PCIe FPGA board outline and dimensions

HUINS MFP-VU19P-PCIe: Virtex UltraScale+ VU19P FPGA Prototyping Board

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£32,452.50
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£32,452.50
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Lead time: 26 Weeks

Tax included only for the UK. Shipping calculated at checkout.

Description

9M logic cells in a PCIe card. Keep larger RTL partitions on one FPGA; connect the prototype directly to a host through PCIe Gen4 x8; exercise memory, application-specific I/O and serial links on the same platform. 8GB onboard DDR4, supplied 8GB SODIMM, 36 routed GTY lanes, dual FMC+ and dual QSFP+. For ASIC/SoC prototyping, PCIe subsystem validation, acceleration and high-speed interface bring-up.

FPGA Specification
Logic
System Logic Cells (K) 8,938
CLB Flip-Flops (K) 8,172
CLB LUTs (K) 4,086
Memory
Max. Distributed RAM (Mb) 58.4
Total Block RAM (Mb) 75.9
UltraRAM (Mb) 90.0
DSP
DSP Slices 3,840
Peak INT8 DSP (TOP/s) 10.4
Hardened IP
PCIe Gen3 x16 / Gen4 x8 8
Transceivers and I/O
GTY 32.75Gb/s Transceivers 80
Max. Single-Ended HP I/Os 1,976
Max. Single-Ended HD I/Os 96
Package and Grade
FPGA XCVU19P-2FSVB3824E
Footprint B3824, 65 × 65mm, 1.0mm ball pitch
B3824 HPIO / HDIO / GTY 1,664 / 96 / 80
Speed Grade -2
Temperature Grade Extended, 0°C to 110°C junction temperature

Source: UltraScale+ FPGA Product Selection Guide. Device maxima do not mean every resource is routed to a board connector.

Features

FPGA
Device XCVU19P-2FSVB3824E, chip-mounted
Memory
Onboard DDR4 8GB
DDR4 SODIMM 1× slot; supplied with Samsung 8GB DDR4-3200, 1Rx8, M471A1K43EB1-CWE
High-Speed Interfaces
PCIe Gen3 x16 / Gen4 x8; selectable x1/x4/x8/x16 lane width shown by HUINS
FMC+ 2× FMC HSPC+; aggregate 36 GTY + 160 I/O according to HUINS
QSFP+ 2× ports
Ethernet 10/100/1000BASE-T
User I/O
Switches 8× DIP switches; 3× push buttons
Headers 16-pin XIO header; 10-pin MIO header
LEDs 12× user LEDs
Cooling and Power
FPGA Cooling Fitted active cooling assembly
Supplied PSU 12V, 12.5A; 6-pin Molex connector

What's Included

  • 1× HUINS MFP-VU19P-PCIe board with fitted cooling assembly
  • 1× Samsung 8GB DDR4-3200 SODIMM, M471A1K43EB1-CWE
  • 1× 12V, 12.5A power supply with 6-pin Molex connector
  • 1× USB Micro cable
  • 1× SD card

UltraScale+ FPGA Product Selection Guide

Full documentation including the user manual, pinout list and schematics will be provided by CodeRobin.

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